For hardware engineers integrating UFS 3.1 into a new design, several key factors must be managed to ensure a robust and reliable system.
Guarded heavily by surrounding ground pads to prevent clock jitter. 2.9V - 3.3V Analog Located near decoupling capacitor paths on the PCB layout. VCCQ 1.2V Digital
UFS 3.1 is backward compatible with UFS 2.1 pinouts, but VCCQ2 (1.2V for advanced low-power states) is more common. Missing VCCQ2 may prevent HS-G4 (Gear 4) speeds.
The UFS 3.1 pinout represents a sophisticated leap from the parallel legacy of eMMC. By utilizing differential serial lanes ( DATAIN/OUT ), a dedicated reference clock ( REFCLK ), and dual-voltage power rails ( VCC and VCCQ2 ), UFS 3.1 achieves the bandwidth necessary for 4K video recording, high-speed app loading, and rapid file transfers. ufs 3.1 pinout
The pins (or solder balls) on a UFS 3.1 IC are strictly divided into three functional groups: , Control/Reference Signals , and Power/Ground Distribution .
Whether you are designing a flagship smartphone, an automotive domain controller, or a rugged industrial system, the UFS 3.1 interface—with its well‑defined pinout and industry‑wide support—delivers the storage performance you need. Keep this guide handy, always consult the official datasheets for your chosen part, and you will be well on your way to a successful UFS 3.1 integration.
: eMMC relies heavily on 1.8V/3.3V infrastructure, whereas UFS 3.1 introduces the optimized 1.2V VCCQ2 rail for high-speed M-PHY signaling. For hardware engineers integrating UFS 3
Design Note: Differential pairs must be routed with strict impedance matching (typically 85 to 100 ohms differential) and equal trace lengths to prevent phase skew. 2. Power Supply and Ground Rails
Because UFS 3.1 datasheets are under NDA for many manufacturers, your best public resources are:
: A low-power state introduced in UFS 3.1 that allows the device to share voltage regulators with other components to save costs and power. VCCQ 1
Route the differential pairs ( DIN and DOUT ) as short and direct as possible from the host processor to the storage BGA pads.
UFS 3.1 utilizes a full-duplex serial interface with MIPI M-PHY physical layer and UniPro link layer protocols. This architecture allows simultaneous reading and writing, drastically increasing throughput. The physical manifestation of this advanced architecture is a grid of solder balls (BGA) underneath the chip. UFS 3.1 Physical Package (BGA)